TAPE WITH BUILT-IN IC CHIP, METHOD FOR MANUFACTURING THE TAPE, AND SHEET WITH BUILD-IN IC CHIP

A sheet with built-in IC chip, wherein mechanical external force is not easily applied on an IC chip and dropping and damages of the IC chip are eliminated, a tape with built-in IC chip to be used for the sheet, and a method for manufacturing such tape. In the tape with built-in IC chip, the whole o...

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Bibliographische Detailangaben
Hauptverfasser:	OZAKI TUYOSHI, KOBAYASHI HIDEKI, TOMITA KEITARO, KANDA NOBUO, UTAKA KEIICHI, SUGIMURA SHIRO, SAITO MITUGI, AYAKI MITSUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BOOK COVERS BOOKBINDING CALCULATING COMPUTING COUNTING DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR FILES HANDLING RECORD CARRIERS LOOSE LEAVES MOVABLE-STRIP WRITING OR READING APPARATUS PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS SPECIAL PRINTED MATTER TRANSPORTING
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Beschreibung
Zusammenfassung:	A sheet with built-in IC chip, wherein mechanical external force is not easily applied on an IC chip and dropping and damages of the IC chip are eliminated, a tape with built-in IC chip to be used for the sheet, and a method for manufacturing such tape. In the tape with built-in IC chip, the whole or a part of an IC chip (10) is embedded in a recessed part (20a) provided on a tape main body. The tape main body (20) is provided with successively laminated first base material (21), an adhesive layer (22) composed of an adhesive, and a second base material (23). The second base material (23) in the recessed part (20a) and on its peripheral part is removed, the adhesive of the adhesive layer (22) in the recessed part (20a) is pushed aside, and a space between the circumference plane of the IC chip (10) and the second base material (23) is filled with the adhesive pushed aside.