FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Provided is a flexible printed circuit board, which allows formation of fine interconnection lines, has excellent dimensional stability and heat resistance, and is not deformed even when using lead-free soldering. The flexible printed circuit board comprises a polyimide film based on paraphenylene d...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SAWASAKI KOICHI, MAEDA MEGURU, OGUNI MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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