FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Provided is a flexible printed circuit board, which allows formation of fine interconnection lines, has excellent dimensional stability and heat resistance, and is not deformed even when using lead-free soldering. The flexible printed circuit board comprises a polyimide film based on paraphenylene d...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SAWASAKI KOICHI, MAEDA MEGURU, OGUNI MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided is a flexible printed circuit board, which allows formation of fine interconnection lines, has excellent dimensional stability and heat resistance, and is not deformed even when using lead-free soldering. The flexible printed circuit board comprises a polyimide film based on paraphenylene diamine and 4,4'-diaminodiphenyl ether as diamine components and pyromellitic dianhydride and 3,3',4,4'-biphnyl carboxylic dianhydride as acid dianhydride components. Interconnection lines are formed on either surface or both surfaces of the polyimide film by way of an adhesive. In a variant, interconnection lines are formed on either surface or both surfaces of the polyimide film by using no adhesive. In another variant, interconnection lines are formed on one surface of the polyimide film by way of an adhesive and on the other surface thereof by not using adhesive.