ELECTRONIC PART AND MANUFACTURING METHOD THEREOF, AND, PACKAGE FOR LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREOF

An electronic component and its manufacturing method, and a light emitting diode package and a manufacturing method thereof are provided to utilize effectively a lateral portion of a substrate by forming a cut portion capable of mounting electronic elements at an edge side of the substrate. An elect...

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Bibliographische Detailangaben
Hauptverfasser:	NISIYAMA KENGO, MITSUYAMA KAZUMA, FUKAE HIROYUKI, FUKUMOTO SIGEO, KUDOU KOUJI, YAMAMOTO ITSUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An electronic component and its manufacturing method, and a light emitting diode package and a manufacturing method thereof are provided to utilize effectively a lateral portion of a substrate by forming a cut portion capable of mounting electronic elements at an edge side of the substrate. An electronic component is formed on a ceramic substrate(5). A cut portion(8) is formed at an edge side of the substrate. An electrode is formed on the cut portion to mount electronic elements on the cut portion. A ceramic cover plate is attached to upper or lower surfaces of the substrate to cover an opening of the cut portion.