INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING

A semiconductor structure (5), fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate (10) is formed from a conductive layer (30).

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Bibliographische Detailangaben
Hauptverfasser:	DODD SIMON, BRYANT FRANK R, MCMAHON TERRY E, HINDMAN GREGORY T, WANG S. JONATHAN, MILLER RICHARD TODD, TOM DENNIS W
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor structure (5), fluid ejection device, and methods for manufacturing the same are provided, such that a contact to a substrate (10) is formed from a conductive layer (30).