PHOTORESIST COATING APPARATUS AND METHOD FOR PROCESSING SUCK BACK THEREOF

A photoresist applying apparatus and a suck back processing method are provided to accurately supply a photoresist liquid by synchronizing a recovery completing point of a diaphragm and a spraying completing point of the photoresist liquid. A nozzle(140) sprays a photoresist liquid supplied from a p...

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Bibliographische Detailangaben
1. Verfasser:	LIM, JONG KILL
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A photoresist applying apparatus and a suck back processing method are provided to accurately supply a photoresist liquid by synchronizing a recovery completing point of a diaphragm and a spraying completing point of the photoresist liquid. A nozzle(140) sprays a photoresist liquid supplied from a photoresist liquid source onto a semiconductor substrate. The photoresist liquid source is connected to the nozzle by a duct(134) for forming a flow path of the photoresist liquid. A suck back valve(110) is installed in the duct, and has a diaphragm(112) for uniformly supplying the photoresist liquid from the nozzle and controlling suck back operation of the photoresist liquid. The suck back valve is controlled in such a way that a recovery completing point of the diaphragm and a spraying completing point of the photoresist liquid are synchronized.