APPARATUS AND METHODS FOR SLURRY CLEANING OF ETCH CHAMBERS

Described are methods of cleaning debris from semiconductor etch chambers or chamber components, one method comprising directing atomized abrasive slurry onto at least some internal surfaces of such a chamber or chamber components. Apparatus for carrying out the methods are also described.

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Bibliographische Detailangaben
Hauptverfasser: LAUBE DAVID P, DAVIS IAN MARTIN
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Described are methods of cleaning debris from semiconductor etch chambers or chamber components, one method comprising directing atomized abrasive slurry onto at least some internal surfaces of such a chamber or chamber components. Apparatus for carrying out the methods are also described.