EDGE RING OF DRY ETCHING APPARATUS

An edge ring of a dry etching apparatus is provided to solve wafer contamination caused by polymer, a chucking defect or a leaking problem of cooling gas by improving adhesion of polymer generated during an etch process through an edge ring with desired surface roughness and by minimizing delamination of polymer deposition from the surface of the edge ring. A body(110) is of ring type to surround a wafer. A step part(130) horizontally extended from an end part of the inner circumference of the body toward the inside of the body. A flat zone part(132) is formed in a predetermined part of the step part, corresponding to the flat zone of the wafer. The upper surface of the body is connected to the step part by a slope part(120). In an edge ring, uniform surface roughness(140) is formed on the upper surface of the body, the step part and the surface of the slope part. The edge ring is made of one selected from a ceramic group composed of quartz, Al2O3 and SiC.