PHOTOSENSITIVE RESIN COMPOSITION COMPRISING ORGANIC AND INORGANIC COMPOUND

A photosensitive resin composition comprising organic and inorganic compounds is provided to represent superior adhesiveness, heat resistance, heat insulation, flatness and chemical resistance, and improve sensitivity and film residual of resist resin for color filter, black matrix, column spacer or...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHOI, SANG GAK, JEONG, UI CHEOL, KIM, BYUNG UK, KIM, DONG MYUNG, YOUN, HYOC MIN, KOO, KI HYUK, SHIN, HONG DAE, YUN, JOO PYO, YEO, TAE HOON, LEE, DONG HYUK, LEE, HO JIN
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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