PHOTOSENSITIVE RESIN COMPOSITION COMPRISING ORGANIC AND INORGANIC COMPOUND

A photosensitive resin composition comprising organic and inorganic compounds is provided to represent superior adhesiveness, heat resistance, heat insulation, flatness and chemical resistance, and improve sensitivity and film residual of resist resin for color filter, black matrix, column spacer or overcoat by including metal oxide, acrylic copolymer, photo-initiator, multi-functional monomer and silicon based compound. The photosensitive resin composition comprises: (A) 1 to 60wt.% of metal oxide selected from a group consisting of oxides of 3, 4, 5 and 13 families metals or oxides of similar two elements metals; (B) 40 to 99wt.% organic photosensitive resin, wherein (B) components contain (a) 100wt. parts of acrylic copolymer, (b) 0.001 to 30wt. parts of photo-initiator, (c) 10 to 100wt. parts of multi-functional monomer having ethylene unsaturated bonds, (d) 0.0001 to 5wt. parts of silicon based compound having epoxy group or amine group, and (d) solvent so as to have solid content of 10 to 50wt.%. The metal oxide is selected from a group consisting of Al2O3, Y2O3, La2O3, Ta2O3, TiO2, HfO2 and ZrO2.