PACKAGE SUBSTRATE HAVING SURFACE STRUCTURE ADAPTED FOR ADHESIVE FLOW CONTROL AND SEMICONDUCTOR PACKAGE USING THE SAME

A package substrate having a surface structure for controlling a flow of adhesive is provided to increase a receiving space of adhesive and avoid a surplus flow by including a surface structure in which a groove is formed in the lower surface of the surface structure and an unevenness part is formed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM, PYOUNG WAN, RYU, JUNG SEOK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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