PACKAGE SUBSTRATE HAVING SURFACE STRUCTURE ADAPTED FOR ADHESIVE FLOW CONTROL AND SEMICONDUCTOR PACKAGE USING THE SAME

A package substrate having a surface structure for controlling a flow of adhesive is provided to increase a receiving space of adhesive and avoid a surplus flow by including a surface structure in which a groove is formed in the lower surface of the surface structure and an unevenness part is formed by the groove. A package substrate(110) includes a through hole(113) lengthily formed along the center part of the package substrate, including an upper surface and a lower surface which are covered with protective layers(114). A groove(215) not covered with the protective layer is formed in a partial region of the lower surface to form an unevenness part in the lower surface. The groove is elongated along both sides of the through hole.