PACKAGE SUBSTRATE HAVING SURFACE STRUCTURE ADAPTED FOR ADHESIVE FLOW CONTROL AND SEMICONDUCTOR PACKAGE USING THE SAME

PACKAGE SUBSTRATE HAVING SURFACE STRUCTURE ADAPTED FOR ADHESIVE FLOW CONTROL AND SEMICONDUCTOR PACKAGE USING THE SAME

A package substrate having a surface structure for controlling a flow of adhesive is provided to increase a receiving space of adhesive and avoid a surplus flow by including a surface structure in which a groove is formed in the lower surface of the surface structure and an unevenness part is formed...

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Hauptverfasser: KIM, PYOUNG WAN, RYU, JUNG SEOK
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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RYU, JUNG SEOK
description A package substrate having a surface structure for controlling a flow of adhesive is provided to increase a receiving space of adhesive and avoid a surplus flow by including a surface structure in which a groove is formed in the lower surface of the surface structure and an unevenness part is formed by the groove. A package substrate(110) includes a through hole(113) lengthily formed along the center part of the package substrate, including an upper surface and a lower surface which are covered with protective layers(114). A groove(215) not covered with the protective layer is formed in a partial region of the lower surface to form an unevenness part in the lower surface. The groove is elongated along both sides of the through hole.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20070010410A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20070010410A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20070010410A3</originalsourceid><addsrcrecordid>eNqNjMEKwjAMhnfxIOo7BDwLnQqeY5uuY3MdbTqPY0g9iQ6m728FvXtK8v9fvnn2alFWWBD4cPTskAkMdmVTpMBplKlgFyQHR4AKWyYF2rq0G_JlR6BrewZpG3a2BmwUeDqV6VbpKXE_ffAfJ5vkwxMts9l1uE1x9Z2LbK2JpdnE8dHHaRwu8R6ffeW2QhyEyMU-F7j7j3oD0-E53Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PACKAGE SUBSTRATE HAVING SURFACE STRUCTURE ADAPTED FOR ADHESIVE FLOW CONTROL AND SEMICONDUCTOR PACKAGE USING THE SAME</title><source>esp@cenet</source><creator>KIM, PYOUNG WAN ; RYU, JUNG SEOK</creator><creatorcontrib>KIM, PYOUNG WAN ; RYU, JUNG SEOK</creatorcontrib><description>A package substrate having a surface structure for controlling a flow of adhesive is provided to increase a receiving space of adhesive and avoid a surplus flow by including a surface structure in which a groove is formed in the lower surface of the surface structure and an unevenness part is formed by the groove. A package substrate(110) includes a through hole(113) lengthily formed along the center part of the package substrate, including an upper surface and a lower surface which are covered with protective layers(114). A groove(215) not covered with the protective layer is formed in a partial region of the lower surface to form an unevenness part in the lower surface. The groove is elongated along both sides of the through hole.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20070124&amp;DB=EPODOC&amp;CC=KR&amp;NR=20070010410A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20070124&amp;DB=EPODOC&amp;CC=KR&amp;NR=20070010410A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, PYOUNG WAN</creatorcontrib><creatorcontrib>RYU, JUNG SEOK</creatorcontrib><title>PACKAGE SUBSTRATE HAVING SURFACE STRUCTURE ADAPTED FOR ADHESIVE FLOW CONTROL AND SEMICONDUCTOR PACKAGE USING THE SAME</title><description>A package substrate having a surface structure for controlling a flow of adhesive is provided to increase a receiving space of adhesive and avoid a surplus flow by including a surface structure in which a groove is formed in the lower surface of the surface structure and an unevenness part is formed by the groove. A package substrate(110) includes a through hole(113) lengthily formed along the center part of the package substrate, including an upper surface and a lower surface which are covered with protective layers(114). A groove(215) not covered with the protective layer is formed in a partial region of the lower surface to form an unevenness part in the lower surface. The groove is elongated along both sides of the through hole.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjMEKwjAMhnfxIOo7BDwLnQqeY5uuY3MdbTqPY0g9iQ6m728FvXtK8v9fvnn2alFWWBD4cPTskAkMdmVTpMBplKlgFyQHR4AKWyYF2rq0G_JlR6BrewZpG3a2BmwUeDqV6VbpKXE_ffAfJ5vkwxMts9l1uE1x9Z2LbK2JpdnE8dHHaRwu8R6ffeW2QhyEyMU-F7j7j3oD0-E53Q</recordid><startdate>20070124</startdate><enddate>20070124</enddate><creator>KIM, PYOUNG WAN</creator><creator>RYU, JUNG SEOK</creator><scope>EVB</scope></search><sort><creationdate>20070124</creationdate><title>PACKAGE SUBSTRATE HAVING SURFACE STRUCTURE ADAPTED FOR ADHESIVE FLOW CONTROL AND SEMICONDUCTOR PACKAGE USING THE SAME</title><author>KIM, PYOUNG WAN ; RYU, JUNG SEOK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20070010410A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, PYOUNG WAN</creatorcontrib><creatorcontrib>RYU, JUNG SEOK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, PYOUNG WAN</au><au>RYU, JUNG SEOK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PACKAGE SUBSTRATE HAVING SURFACE STRUCTURE ADAPTED FOR ADHESIVE FLOW CONTROL AND SEMICONDUCTOR PACKAGE USING THE SAME</title><date>2007-01-24</date><risdate>2007</risdate><abstract>A package substrate having a surface structure for controlling a flow of adhesive is provided to increase a receiving space of adhesive and avoid a surplus flow by including a surface structure in which a groove is formed in the lower surface of the surface structure and an unevenness part is formed by the groove. A package substrate(110) includes a through hole(113) lengthily formed along the center part of the package substrate, including an upper surface and a lower surface which are covered with protective layers(114). A groove(215) not covered with the protective layer is formed in a partial region of the lower surface to form an unevenness part in the lower surface. The groove is elongated along both sides of the through hole.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title PACKAGE SUBSTRATE HAVING SURFACE STRUCTURE ADAPTED FOR ADHESIVE FLOW CONTROL AND SEMICONDUCTOR PACKAGE USING THE SAME
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-24T13%3A26%3A24IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KIM,%20PYOUNG%20WAN&rft.date=2007-01-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20070010410A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true