PRINTED CIRCUIT BOARD WITH EMBEDDED COAXIAL CABLE AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD WITH EMBEDDED COAXIAL CABLE AND MANUFACTURING METHOD THEREOF

A printed circuit board with an embedded coaxial cable and a method for manufacturing the same are provided to easily embed the coaxial cable in the board by performing a metal bump build-up process. A first conductive film is formed on a first insulation(90), and a first metal bump is formed on the...

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Hauptverfasser: SHIN, HYE RA, LEE, HYUN JUN
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator SHIN, HYE RA
LEE, HYUN JUN
description A printed circuit board with an embedded coaxial cable and a method for manufacturing the same are provided to easily embed the coaxial cable in the board by performing a metal bump build-up process. A first conductive film is formed on a first insulation(90), and a first metal bump is formed on the first conductive film. A second insulation film(120) is formed on a substrate with the first metal bump. Then, a second conductive film is formed on the second insulation film, and is subjected to a pattern process to form a second conductive circuit. A second metal bump is selectively formed on the second conductive film circuit, and a third insulation film(160) is formed on the substrate with the second metal bump. A third conductive film is formed on the third insulation film, and is processed by a pattern process to form a third conductive film circuit(180).
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title PRINTED CIRCUIT BOARD WITH EMBEDDED COAXIAL CABLE AND MANUFACTURING METHOD THEREOF
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