PRINTED CIRCUIT BOARD WITH EMBEDDED COAXIAL CABLE AND MANUFACTURING METHOD THEREOF

A printed circuit board with an embedded coaxial cable and a method for manufacturing the same are provided to easily embed the coaxial cable in the board by performing a metal bump build-up process. A first conductive film is formed on a first insulation(90), and a first metal bump is formed on the...

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Bibliographische Detailangaben
Hauptverfasser:	SHIN, HYE RA, LEE, HYUN JUN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A printed circuit board with an embedded coaxial cable and a method for manufacturing the same are provided to easily embed the coaxial cable in the board by performing a metal bump build-up process. A first conductive film is formed on a first insulation(90), and a first metal bump is formed on the first conductive film. A second insulation film(120) is formed on a substrate with the first metal bump. Then, a second conductive film is formed on the second insulation film, and is subjected to a pattern process to form a second conductive circuit. A second metal bump is selectively formed on the second conductive film circuit, and a third insulation film(160) is formed on the substrate with the second metal bump. A third conductive film is formed on the third insulation film, and is processed by a pattern process to form a third conductive film circuit(180).