PROVIDING DIFFERENTIATED LEVELS OF SOLDER PASTE FOR A CIRCUIT PASTE FOR A CIRCUIT BOARD

The present invention relates to a method and apparatus for providing differentiated levels of electrical contacting material on a circuit board (22), where a first screen (24) is placed on the circuit board, electric contacting material is placed in holes (26) provided in the first screen (24) in o...

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Bibliographische Detailangaben
1. Verfasser:	FAGRENIUS GUSTAV
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention relates to a method and apparatus for providing differentiated levels of electrical contacting material on a circuit board (22), where a first screen (24) is placed on the circuit board, electric contacting material is placed in holes (26) provided in the first screen (24) in order to provide at least a first set of areas with contacting material (28) on the board, which areas each have a first level of contacting material, a second screen (30) is placed on the board, which second screen is provided with openings (32) aligned with and facing areas with contacting material (28) provided via the first contacting material masking screen, and electric contacting material is placed in holes (34) provided in the second screen, in order to provide a second set of areas with contacting material (36) on the board, which areas each have a second level of contacting material. ® KIPO & WIPO 2007