METHOD OFEDGE EXPOSURE WAFER

A method for exposing an edge of a wafer is provided to increase effective region of a wafer by detecting a reference position of the edge of the wafer to establish a boundary. An edge(A0') of a wafer is detected. The detected edge of the wafer is established as a reference position. A first ed...

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Bibliographische Detailangaben
Hauptverfasser:	OH, GYEONG HWAN, CHAE, HEE SUN
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method for exposing an edge of a wafer is provided to increase effective region of a wafer by detecting a reference position of the edge of the wafer to establish a boundary. An edge(A0') of a wafer is detected. The detected edge of the wafer is established as a reference position. A first edge boundary(A1') is established at a position separated by a predetermined distance from the detected edge. A width(EEW0) between the detected edge and the first edge boundary is exposed. The first edge boundary is detected without detecting the edge of the wafer. A second edge boundary(A2') is established at a position separated by a predetermined distance from the first edge boundary.