ADHESIVE COMPOSITION FOR CIRCUIT CONNECTION

An adhesive composition which comprises (a) a thermoplastic resin, (b) a radical-polymerizable compound having two or more (meth)acryloyl groups, (c) a curing agent capable of generating a radical through irradiation with 150 to 750 nm rays or heating at 80 to 200°C, and (d) a liquid rubber exhibiti...

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Bibliographische Detailangaben
Hauptverfasser:	YUSA MASAMI, SUTO HOKO, KATOGI SHIGEKI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CURRENT COLLECTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An adhesive composition which comprises (a) a thermoplastic resin, (b) a radical-polymerizable compound having two or more (meth)acryloyl groups, (c) a curing agent capable of generating a radical through irradiation with 150 to 750 nm rays or heating at 80 to 200°C, and (d) a liquid rubber exhibiting by itself a viscosity of 10 to 1000 Pa.s at 25 °C.