VAPOR DEPOSITION SOURCE WITH MINIMIZED CONDENSATION EFFECTS

A thermal physical vapor deposition source for depositing material onto a substrate includes an elongated container for receiving the material, the container having a conductance CB in the elongated direction, and a heater for heating the material in the container to vaporize the material to a parti...

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Bibliographische Detailangaben
Hauptverfasser:	GRACE JEREMY MATTHEW, KLUG JUSTIN HAGER, FREEMAN DENNIS RAY, REDDEN NEIL PATRICK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A thermal physical vapor deposition source for depositing material onto a substrate includes an elongated container for receiving the material, the container having a conductance CB in the elongated direction, and a heater for heating the material in the container to vaporize the material to a partial pressure Pm. The container has at least one member defining a plurality of apertures arranged along the length of the member, the apertures having a total conductance CA, wherein Formula (I) and end heaters for heating each side of the container to reduce condensation of material onto the container.