BONDING APPARATUS OF ELECTRONIC PARTS
A bonding apparatus of electronic units is provided to secure bonding strength of a substrate and electronic units and stabilize conduction between a terminal unit and an electrode unit. In a bonding apparatus(1) of electronic units(4), a vibrating head(7) piezoelectric-bonds a terminal unit formed...
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| creator | NEBASHI TORU |
| description | A bonding apparatus of electronic units is provided to secure bonding strength of a substrate and electronic units and stabilize conduction between a terminal unit and an electrode unit. In a bonding apparatus(1) of electronic units(4), a vibrating head(7) piezoelectric-bonds a terminal unit formed on a substrate(2) and an electrode unit formed at the electronic units(4). A heater(8) is attached to the vibrating head(7) to bond between the substrate(2) and the electronic units(4) by thermal-curing an insulation resin formed on the substrate(2). An insulation unit(9) is installed between the vibrating head(7) and the substrate(2). The terminal unit and the electrode unit is piezoelectric-bonded by using vibration, and the substrate(2) and the electronic units(4) are bonded by the insulation resin. |
| format | Patent |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | BONDING APPARATUS OF ELECTRONIC PARTS |
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