BONDING APPARATUS OF ELECTRONIC PARTS

A bonding apparatus of electronic units is provided to secure bonding strength of a substrate and electronic units and stabilize conduction between a terminal unit and an electrode unit. In a bonding apparatus(1) of electronic units(4), a vibrating head(7) piezoelectric-bonds a terminal unit formed on a substrate(2) and an electrode unit formed at the electronic units(4). A heater(8) is attached to the vibrating head(7) to bond between the substrate(2) and the electronic units(4) by thermal-curing an insulation resin formed on the substrate(2). An insulation unit(9) is installed between the vibrating head(7) and the substrate(2). The terminal unit and the electrode unit is piezoelectric-bonded by using vibration, and the substrate(2) and the electronic units(4) are bonded by the insulation resin.