SEMICONDUCTOR PACKAGE FOR DECAP EASILY AND METHOD FOR MANUFACTURING THE SAME

A semiconductor package is provided to easily decap a chip when an error occurs in testing the chip after a molding process by performing a molding process after a protection cover part is bonded to the edge of the upper surface of a substrate main part. A chip(302), a conductive pattern(303) and a plurality of conductive pads are electrically connected to a substrate(301) to form a substrate main part(300). A protection cover part(320) is bonded to the edge of the upper surface of the substrate main part so that the entire upper part of the substrate main part is covered to protect the chip. A molding part(330) is molded in the upper surface of the protection cover part. The edge of the substrate main part is plated with metal like copper or gold.