A FILM FOR PACKAGING BAGS OF ELECTRONIC PARTS WITH ELECTROSTATIC DISSIPATIVE AND PACKAGING BAGS OF ELECTRONIC PARTS WITH ELECTROSTATIC DISSIPATE USING IT

Bibliographische Detailangaben

Hauptverfasser:	JEONG, SANG KOOK, BAIK, WOON PHIL, JANG, KWAN SIK
Format:	Patent
Sprache:	eng
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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