METHOD FOR FABRICATING PRINTED CIRCUIT BOARD

METHOD FOR FABRICATING PRINTED CIRCUIT BOARD

A method of fabricating a printed circuit board having a fine circuit pattern and a via hole having no residue by forming the circuit pattern using an imprinting process and forming the via hole using a laser.

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Hauptverfasser: SUN, BYUNG KOOK, HAZE TAKAYUKI, KIM, SEUNG CHUL
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator SUN, BYUNG KOOK
HAZE TAKAYUKI
KIM, SEUNG CHUL
description A method of fabricating a printed circuit board having a fine circuit pattern and a via hole having no residue by forming the circuit pattern using an imprinting process and forming the via hole using a laser.
format Patent
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title METHOD FOR FABRICATING PRINTED CIRCUIT BOARD
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