METHOD FOR FABRICATING PRINTED CIRCUIT BOARD

A method of fabricating a printed circuit board having a fine circuit pattern and a via hole having no residue by forming the circuit pattern using an imprinting process and forming the via hole using a laser.

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Bibliographische Detailangaben
Hauptverfasser:	SUN, BYUNG KOOK, HAZE TAKAYUKI, KIM, SEUNG CHUL
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A method of fabricating a printed circuit board having a fine circuit pattern and a via hole having no residue by forming the circuit pattern using an imprinting process and forming the via hole using a laser.