LAMINATE FOR FORMING SUBSTRATE WITH WIRES, SUCH SUBSTRATE WITH WIRES, AND METHOD FOR FORMING IT

LAMINATE FOR FORMING SUBSTRATE WITH WIRES, SUCH SUBSTRATE WITH WIRES, AND METHOD FOR FORMING IT

To provide a laminate for forming a substrate with wires, which has a low resistance, is free from hillocks, has a small surface roughness and is excellent in alkali resistance and corrosion resistance, particularly a laminate suitable for a flat panel display such as an organic EL display, a method...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: HIRUMA TAKEHIKO
Format: Patent
Sprache:eng
Schlagworte:
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator HIRUMA TAKEHIKO
description To provide a laminate for forming a substrate with wires, which has a low resistance, is free from hillocks, has a small surface roughness and is excellent in alkali resistance and corrosion resistance, particularly a laminate suitable for a flat panel display such as an organic EL display, a method for forming a substrate with wires by etching the laminate, and the substrate with wires thereby obtained. A laminate for forming a substrate with wires, which comprises a substrate, a conductive layer containing an Al-Nd alloy as the major component and having a content of Nd of from 0.1 to 6 atomic % based on all components, formed on the substrate, and a capping layer containing a Ni-Mo alloy as the major component, formed on the conductive layer; a method for forming the laminate by sputtering, and a substrate with wires, comprising the laminate which is patterned in a flat form.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20060043543A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20060043543A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20060043543A3</originalsourceid><addsrcrecordid>eNrjZIj3cfT19HMMcVVw8w8CYSDPXSE41Ck4JAgkGu4Z4gEkglyDdYCizh44pBz9XBR8XUM8_F1QzPEM4WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgYGZgYGJsamJsaOxsSpAgAQkzPX</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LAMINATE FOR FORMING SUBSTRATE WITH WIRES, SUCH SUBSTRATE WITH WIRES, AND METHOD FOR FORMING IT</title><source>esp@cenet</source><creator>HIRUMA TAKEHIKO</creator><creatorcontrib>HIRUMA TAKEHIKO</creatorcontrib><description>To provide a laminate for forming a substrate with wires, which has a low resistance, is free from hillocks, has a small surface roughness and is excellent in alkali resistance and corrosion resistance, particularly a laminate suitable for a flat panel display such as an organic EL display, a method for forming a substrate with wires by etching the laminate, and the substrate with wires thereby obtained. A laminate for forming a substrate with wires, which comprises a substrate, a conductive layer containing an Al-Nd alloy as the major component and having a content of Nd of from 0.1 to 6 atomic % based on all components, formed on the substrate, and a capping layer containing a Ni-Mo alloy as the major component, formed on the conductive layer; a method for forming the laminate by sputtering, and a substrate with wires, comprising the laminate which is patterned in a flat form.</description><language>eng</language><subject>ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20060515&amp;DB=EPODOC&amp;CC=KR&amp;NR=20060043543A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20060515&amp;DB=EPODOC&amp;CC=KR&amp;NR=20060043543A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIRUMA TAKEHIKO</creatorcontrib><title>LAMINATE FOR FORMING SUBSTRATE WITH WIRES, SUCH SUBSTRATE WITH WIRES, AND METHOD FOR FORMING IT</title><description>To provide a laminate for forming a substrate with wires, which has a low resistance, is free from hillocks, has a small surface roughness and is excellent in alkali resistance and corrosion resistance, particularly a laminate suitable for a flat panel display such as an organic EL display, a method for forming a substrate with wires by etching the laminate, and the substrate with wires thereby obtained. A laminate for forming a substrate with wires, which comprises a substrate, a conductive layer containing an Al-Nd alloy as the major component and having a content of Nd of from 0.1 to 6 atomic % based on all components, formed on the substrate, and a capping layer containing a Ni-Mo alloy as the major component, formed on the conductive layer; a method for forming the laminate by sputtering, and a substrate with wires, comprising the laminate which is patterned in a flat form.</description><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIj3cfT19HMMcVVw8w8CYSDPXSE41Ck4JAgkGu4Z4gEkglyDdYCizh44pBz9XBR8XUM8_F1QzPEM4WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgYGZgYGJsamJsaOxsSpAgAQkzPX</recordid><startdate>20060515</startdate><enddate>20060515</enddate><creator>HIRUMA TAKEHIKO</creator><scope>EVB</scope></search><sort><creationdate>20060515</creationdate><title>LAMINATE FOR FORMING SUBSTRATE WITH WIRES, SUCH SUBSTRATE WITH WIRES, AND METHOD FOR FORMING IT</title><author>HIRUMA TAKEHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20060043543A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>HIRUMA TAKEHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIRUMA TAKEHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LAMINATE FOR FORMING SUBSTRATE WITH WIRES, SUCH SUBSTRATE WITH WIRES, AND METHOD FOR FORMING IT</title><date>2006-05-15</date><risdate>2006</risdate><abstract>To provide a laminate for forming a substrate with wires, which has a low resistance, is free from hillocks, has a small surface roughness and is excellent in alkali resistance and corrosion resistance, particularly a laminate suitable for a flat panel display such as an organic EL display, a method for forming a substrate with wires by etching the laminate, and the substrate with wires thereby obtained. A laminate for forming a substrate with wires, which comprises a substrate, a conductive layer containing an Al-Nd alloy as the major component and having a content of Nd of from 0.1 to 6 atomic % based on all components, formed on the substrate, and a capping layer containing a Ni-Mo alloy as the major component, formed on the conductive layer; a method for forming the laminate by sputtering, and a substrate with wires, comprising the laminate which is patterned in a flat form.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_KR20060043543A
source esp@cenet
subjects ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
title LAMINATE FOR FORMING SUBSTRATE WITH WIRES, SUCH SUBSTRATE WITH WIRES, AND METHOD FOR FORMING IT
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T22%3A00%3A26IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HIRUMA%20TAKEHIKO&rft.date=2006-05-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20060043543A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true