LAMINATE FOR FORMING SUBSTRATE WITH WIRES, SUCH SUBSTRATE WITH WIRES, AND METHOD FOR FORMING IT

To provide a laminate for forming a substrate with wires, which has a low resistance, is free from hillocks, has a small surface roughness and is excellent in alkali resistance and corrosion resistance, particularly a laminate suitable for a flat panel display such as an organic EL display, a method...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: HIRUMA TAKEHIKO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:To provide a laminate for forming a substrate with wires, which has a low resistance, is free from hillocks, has a small surface roughness and is excellent in alkali resistance and corrosion resistance, particularly a laminate suitable for a flat panel display such as an organic EL display, a method for forming a substrate with wires by etching the laminate, and the substrate with wires thereby obtained. A laminate for forming a substrate with wires, which comprises a substrate, a conductive layer containing an Al-Nd alloy as the major component and having a content of Nd of from 0.1 to 6 atomic % based on all components, formed on the substrate, and a capping layer containing a Ni-Mo alloy as the major component, formed on the conductive layer; a method for forming the laminate by sputtering, and a substrate with wires, comprising the laminate which is patterned in a flat form.