COMPOSITIONS FOR PREPARING LOW DIELECTRIC MATERIALS CONTAINING SOLVENTS

Silica-based materials and films having a dielectric constant of 3.7 or below and compositions and methods for making and using same are disclosed herein. In one aspect, there is provided a composition for preparing a silica-based material comprising an at least one silica source, a solvent, an at l...

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Bibliographische Detailangaben
Hauptverfasser: WEIGEL SCOTT JEFFREY, MACDOUGALL JAMES EDWARD, KHOT SHRIKANT NARENDRA, BRAYMER THOMAS ALBERT, PETERSON BRIAN KEITH, KIRNER JOHN FRANCIS
Format: Patent
Sprache:eng
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Zusammenfassung:Silica-based materials and films having a dielectric constant of 3.7 or below and compositions and methods for making and using same are disclosed herein. In one aspect, there is provided a composition for preparing a silica-based material comprising an at least one silica source, a solvent, an at least one porogen, optionally a catalyst, and optionally a flow additive wherein the solvent boils at a temperature ranging from 90°C to 170°C and is selected from the group of compounds represented by the following formulas: HO-CHR8-CHR9-CH2-CHR10R11 where R8, R9, R10 and R11 can independently be an alkyl group ranging from 1 to 4 carbon atoms or a hydrogen atom; and R12-CO-R13 where R12 is a hydrocarbon group having from 3 to 6 carbon atoms; R13 is a hydrocarbon group having from 1 to 3 carbon atoms; and mixtures thereof.