PRINTED WIRING BOARD, ITS MANUFACTURING METHOD, AND CIRCUIT DEVICE

[MEANS FOR SOLVING PROBLEMS] A method of manufacturing a printed wiring board is characterized in that a conductive metal layer is formed over at least one surface of an insulating film via a sputtering metal layer, the sputtering metal layer and the conductive metal layer are removed selectively by etching so as to form a wiring pattern, the multilayer film is treated with a first treating liquid capable of dissolving Ni contained in the sputtering metal layer and treated with a second treating liquid capable of dissolving Cr contained in the sputtering metal layer and removing the sputtering metal layer on the insulating film, and the sputtering metal remaining on the portion of the surface layer of the insulating film on which the wiring pattern is not formed is removed together with the insulating film surface layer. A printed wiring board is characterized in that the thickness of the portion of the insulating film on which the wiring pattern is not formed is smaller by 1 to 100 nm than that of the portion of the insulating film on which the wiring pattern is formed. The sputtering metal bonded to the insulating film is removed together with the insulating film and no metal remains on the surface of the portion of the insulating film between the wiring patterns. Therefore, a short circuit between the wiring patterns hardly occurs.