RESIN COMPOSITION FOR CLAD LAMINATION OF FLEXIBLE CIRCUIT BOARD, THE FLEXIBLE METAL LAMINATION BOARD USING THEREOF AND THE METHOD FOR MANUFACTURING THE FLEXIBLE METAL LAMINATION BOARD

Bibliographische Detailangaben

Hauptverfasser:	LEE, KYUNG JUN, BYUN, JEONG IL, LIM, SO YEON, PARK, KYU SOON
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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