THIN FILM FORMING APPARATUS AND METHOD FOR FORMING THIN FILM

A thin film forming apparatus comprising first and second electrodes and a gas supply portion is disclosed. Discharge surfaces of the first and second electrodes are opposite to each other so as to form a discharge space where a high frequency electric field is generated. The gas supply portion supp...

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Bibliographische Detailangaben
Hauptverfasser:	MAEDA KIKUO, FUKAZAWA KOJI, TODA YOSHIROU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A thin film forming apparatus comprising first and second electrodes and a gas supply portion is disclosed. Discharge surfaces of the first and second electrodes are opposite to each other so as to form a discharge space where a high frequency electric field is generated. The gas supply portion supplies a gas containing a thin film forming gas into the discharge space so that the gas is activated by the high frequency electric field and a thin film is formed on a base material by exposing the base material to the activated gas. The thin film forming apparatus also comprises a film carrying mechanism for carrying a cleaning film which prevents at least one of the first and second electrodes from being exposed to the activated gas. The film carrying mechanism carries the cleaning film so that the film is in close contact with the discharge surface of at least one of the first and second electrodes and at least a part of other surface continued to the discharge surface.