METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT HAVING A BARRIER-LINED OPENING

A semiconductor component (10) having a metallization system that includes a thin conformal multi-layer barrier structure (60) and a method for manufacturing the semiconductor component (10). A layer of dielectric material (30, 34) is formed over a lower level interconnect. A hardmask (36) is formed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG PIN CHIN CONNIE, HUANG RICHARD J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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