AREA-ARRAY DEVICE ASSEMBLY WITH PRE-APPLIED UNDERFILL LAYERS ON PRINTED WIRING BOARD

The invention provides a method of attaching an area-array device such as a bumped flip chip (110) to an electrical substrate (150), for example a printed circuit board panel. An underfill material (140) is applied to a portion of the electrical substrate (150), and the underfill material (140) is h...

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Bibliographische Detailangaben
Hauptverfasser:	DANVIR JANICE M, QI JING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention provides a method of attaching an area-array device such as a bumped flip chip (110) to an electrical substrate (150), for example a printed circuit board panel. An underfill material (140) is applied to a portion of the electrical substrate (150), and the underfill material (140) is heated to an underfill material staging temperature. A bumped area-array device (110) is provided, the bumped area-array device (110) including an interconnection surface (112). The interconnection surface (112) of the bumped area-array device (110) is positioned adjacent the applied underfill material (140). The bumped area-array device (110) is heated to electrically connect the connective bumps (120) to the electrical substrate (150).