DEVICE AND METHOD FOR PROCESSING ELECTRIC CIRCUIT SUBSTRATES BY LASER

According to the invention, a laser source (1) with a diode-pumped, goods-controlled, pulsed solid body laser is used to process electric circuit substrates. The laser radiation of said laser has a wave length of between 266 nm and 1064 nm, a pulse repetition rate of between 1 kHz and 1 MHz and a pu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ROELANTS EDDY, LESJAK STEFAN, EDME SEBASTIEN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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