DEVICE AND METHOD FOR PROCESSING ELECTRIC CIRCUIT SUBSTRATES BY LASER

According to the invention, a laser source (1) with a diode-pumped, goods-controlled, pulsed solid body laser is used to process electric circuit substrates. The laser radiation of said laser has a wave length of between 266 nm and 1064 nm, a pulse repetition rate of between 1 kHz and 1 MHz and a pu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ROELANTS EDDY, LESJAK STEFAN, EDME SEBASTIEN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	According to the invention, a laser source (1) with a diode-pumped, goods-controlled, pulsed solid body laser is used to process electric circuit substrates. The laser radiation of said laser has a wave length of between 266 nm and 1064 nm, a pulse repetition rate of between 1 kHz and 1 MHz and a pulse length of 30 ns - 200 ns for an average laser power rate of between 0.1 W and approx. 5 W. Predetermined operational modes with correspondingly different combinations of laser power and repetition frequencies can be adjusted by controlling each application in order to selectively provide a hole operation mode, an ablation operation mode or an illumination operation mode using the same laser. The laser beam is deflected to the substrate corresponding to the respective operation mode by means of an adjustable galvo mirror deflection unit and by the control unit.