ELECTRONIC PARTS BOARD AND METHOD OF PRODUCING THE SAME

ELECTRONIC PARTS BOARD AND METHOD OF PRODUCING THE SAME

An electronic parts board (1-1) comprising an insulation base block (10), and a flexible circuit board (20) having terminal patterns (29, 29) formed on a synthetic resin film attached to the insulation base block (10) and a resistor pattern (25) formed on the surface thereof on which a slider slides...

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Bibliographische Detailangaben
Hauptverfasser: MITSUI KOJI, FUKUDA NAOKI, YANOSHITA KATSUTOSHI, MAKINO DAISUKE, NAKAGOME KAZUTAKA, MORITA KOZO, MIZUNO SHINJI, SHINOKI TAKASHI, SUZUKI SHINICHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
RESISTORS
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Beschreibung
Zusammenfassung:An electronic parts board (1-1) comprising an insulation base block (10), and a flexible circuit board (20) having terminal patterns (29, 29) formed on a synthetic resin film attached to the insulation base block (10) and a resistor pattern (25) formed on the surface thereof on which a slider slides. The insulation base block (10) is a synthetic resin molded article. The flexible circuit board (20) is insert-molded in the insulation base block (10). The electronic parts board (1-1) is produced by preparing the flexible circuit board (20) and first and second molds (41, 45) having a cavity (C1) formed to have the external shape of the electronic parts board (1-1), receiving the flexible circuit board (20) in the cavity (C1) of the first and second molds (41, 45), charging molten molding resin into the cavity (C1), and removing the first and second molds (41, 45) after solidification of the charged molding resin.