ELECTRONIC COMPONENT PLACEMENT MACHINE AND ELECTRONIC COMPONENT PLACEMENT METHOD

An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head (16), provided on rotary chip takeout and transfer mechanism (15), removes a chip (6) from a feeder (2) and flips it. A placement head (14) receives the flipped chip (6) and places it onto a board (10). An image of the chip (6) at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head (16) transfers the chip (6) to the placement head (14) at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip (6) and the placement head (14) are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head (16) is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.