POLISHING FLUID AND POLISHING METHOD

A polishing fluid which comprises at least one of a surfactant and an organic solvent, an oxidized metal dissolving agent and water, or comprises abrasive grains having a surface modified with an alkyl group and water; the polishing fluid which further comprises an oxidizing agent for a metal, or wh...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SAKURADA, TAKAFUMI, AMANOKURA, JIN, ANZAI, SOU, FUKASAWA, MASATO, SASAKI, SHOUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH PREPARATION OF CARBON BLACK SEMICONDUCTOR DEVICES SKI WAXES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES
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Beschreibung
Zusammenfassung:	A polishing fluid which comprises at least one of a surfactant and an organic solvent, an oxidized metal dissolving agent and water, or comprises abrasive grains having a surface modified with an alkyl group and water; the polishing fluid which further comprises an oxidizing agent for a metal, or which further comprises an oxidizing agent for a metal and a water-soluble polymer, or which further comprises an oxidizing agent for a metal, a water-soluble polymer and a corrosion inhibitor for a metal; and a method of chemical mechanical polishing using the polishing fluid. The polishing fluid allows a polished surface exhibiting improved flatness to be formed even when a surface to be polished is composed of a plurality of substances and also allows the suppression of metal residues and flaws after polishing, and thus is advantageously used for the polishing in a wiring forming process for a semiconductor device or the like.