NONDESTRUCTIVE RELIABILITY MONITORING METHOD FOR ADHESIVELY BONDED STRUCTURE USING PIEZOELECTRICITIC CHARACTERISTICS OF ADHESIVE MATERIAL

A method for detecting safety of an adhesive structure using piezoelectric characteristics of an adhesive member are provided to measure safety of the adhesive structure by using only simple equipment. A method for detecting the safety of an adhesive structure using piezoelectric characteristics of...

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Bibliographische Detailangaben
Hauptverfasser:	CHIN, WOO SEOK, LEE, SEUNG MIN, KIM, BYUNG CHUL, KWON, JAE WOOK, HWANG, HUI YUN, LEE, DAI GIL
Format:	Patent
Sprache:	eng
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
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Beschreibung
Zusammenfassung:	A method for detecting safety of an adhesive structure using piezoelectric characteristics of an adhesive member are provided to measure safety of the adhesive structure by using only simple equipment. A method for detecting the safety of an adhesive structure using piezoelectric characteristics of an adhesive member is provided with two separated structure member. The two separated structure members are coupled with each other through a conductive line(20). A charge amount and a charge density discharged from the adhesive member through the conductive line(20) are measured. A remaining life span and the damage state of the adhesive member are determined through a charge density. The conductive line(20) is connected to a conductive metal plate. An electrical signal is amplified through the conductive line(20) before measuring the charge density.