ANIS0TROPIC CONDUCTIVITY CONNECTOR, CONDUCTIVE PASTE COMPOSITION, PROBE MEMBER, WAFER INSPECTING DEVICE, AND WAFER INSPECTING METHOD

An anisotropic conductivity connector enabling easy alignment of a wafer and capable of holding and fixing the wafer even if the wafer has a large area and a diameter of 8 inches or more and the pitches of the electrodes to be inspected of the wafer are small and maintaining its favorable conductivity even after repetitive use, and its application are disclosed. The connector comprises a frame sheet where holes for arrangement of anisotropic conductive films are formed in positions corresponding to electrode regions of all or a part of the integrated circuits of a wafer and elastic anisotropic conductive films formed in the holes. Each elastic anisotropic conductive film has connection conductive sections containing conductive particles and extending in the direction of thickness and insulating sections insulating the connection conductive sections from one another. Each conductive particle is composed of a core particle exhibiting magnetism and a high-conductivity metal with which the core particle is coated. The content of the high-conductivity metal to the core particle is 15 mass% or more. The measurand t=[1/(Sw.rho)] x N/(1-N)] is 50 nm or more [Sw is the BET specific surface (m2/kg) of the core particle, rho is the specific gravity (kg/m3) of the high-conductivity metal, and N is (the mass of the high-conductivity metal/the mass of the whole conductive particles).