ANISOTROPIC CONDUCTIVE FILM ADHESIVE COMPRISING EPOXY RESIN, CURING AGENT, EPOXY GROUP-CONTAINING ACRYLIC COPOLYMER PHENOXY RESIN AND CONDUCTIVE PARTICLES, AND FLAT PANEL DISPLAY MANUFACTURED BY USING THE SAME

PURPOSE: Provided are an anisotropic conductive film adhesive having reliability in adhesion and easiness in repair, and a flat panel display manufactured by employing such adhesive. CONSTITUTION: The anisotropic conductive film adhesive comprises an epoxy resin and a curing agent for curing the epo...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, SUE JOO, JEONG, SEONG ROON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PURPOSE: Provided are an anisotropic conductive film adhesive having reliability in adhesion and easiness in repair, and a flat panel display manufactured by employing such adhesive. CONSTITUTION: The anisotropic conductive film adhesive comprises an epoxy resin and a curing agent for curing the epoxy resin; 50-200 parts by weight of a epoxy group-containing acrylic copolymer, based on 100 parts by weight of the epoxy resin; 5-50 parts by weight of a phenoxy resin, based on 100 parts by weight of the epoxy resin and the acrylic copolymer; and 2-30 parts by weight of conductive particles, based on 100 parts by weight of the epoxy resin, the acrylic copolymer and the phenoxy resin. In the composition, the curing agent is preferably a latent imidazole-based curing agent and is employed in an amount of 10-100 parts by weight, based on 100 parts by weight of the epoxy resin. Preferably, the epoxy resin and the epoxy group-containing acrylic copolymer have a number average molecular weight of 5000 or less and 600,000 or more, respectively.