CMP APPARATUS WITH COMPRESSED COIL SPRING FOR CONTROLLING GAP BETWEEN RETAINER RING AND CARRIER

CMP APPARATUS WITH COMPRESSED COIL SPRING FOR CONTROLLING GAP BETWEEN RETAINER RING AND CARRIER

PURPOSE: A CMP(Chemical Mechanical Polishing) apparatus is provided to control the gap between a retainer ring and a carrier by using a compressed coil spring. CONSTITUTION: A CMP apparatus includes a pneumatic membrane(132) for loading and unloading a wafer, a flexure(133), a retainer ring(135) for...

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1. Verfasser: JUNG, MYEONG JIN
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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creator JUNG, MYEONG JIN
description PURPOSE: A CMP(Chemical Mechanical Polishing) apparatus is provided to control the gap between a retainer ring and a carrier by using a compressed coil spring. CONSTITUTION: A CMP apparatus includes a pneumatic membrane(132) for loading and unloading a wafer, a flexure(133), a retainer ring(135) for guiding the wafer and pressing a polishing pad(134), and a fixing screw(138) for fixing the retainer ring to a carrier(137). A compressed coil spring(136) is installed between the retainer ring and the carrier to control the gap between the retainer ring and the carrier.
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language eng ; kor
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subjects BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
title CMP APPARATUS WITH COMPRESSED COIL SPRING FOR CONTROLLING GAP BETWEEN RETAINER RING AND CARRIER
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