CMP APPARATUS WITH COMPRESSED COIL SPRING FOR CONTROLLING GAP BETWEEN RETAINER RING AND CARRIER

PURPOSE: A CMP(Chemical Mechanical Polishing) apparatus is provided to control the gap between a retainer ring and a carrier by using a compressed coil spring. CONSTITUTION: A CMP apparatus includes a pneumatic membrane(132) for loading and unloading a wafer, a flexure(133), a retainer ring(135) for...

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Bibliographische Detailangaben
1. Verfasser:	JUNG, MYEONG JIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE: A CMP(Chemical Mechanical Polishing) apparatus is provided to control the gap between a retainer ring and a carrier by using a compressed coil spring. CONSTITUTION: A CMP apparatus includes a pneumatic membrane(132) for loading and unloading a wafer, a flexure(133), a retainer ring(135) for guiding the wafer and pressing a polishing pad(134), and a fixing screw(138) for fixing the retainer ring to a carrier(137). A compressed coil spring(136) is installed between the retainer ring and the carrier to control the gap between the retainer ring and the carrier.