SEALANT COMPOSITION FOR LIQUID CRYSTAL PANEL COMPRISING PARTIALLY ACRYLATED EPOXY-BASED BINDER RESIN, POTENTIAL THERMAL CURING AGENT, PHOTOINITIATOR AND INORGANIC FILLER

PURPOSE: A sealant composition for a liquid crystal panel is provided, to allow a curing velocity to be controlled easily for reducing processing time, to improve adhesion and to reduce the percent defect of liquid crystal alignment. CONSTITUTION: The sealant composition comprises 100 parts by weigh...

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Hauptverfasser:	JUNG, SANG HYEOP, KIM, UNG, CHOI, BEOM YEONG, KIM, YEONG GEUN, WOO, SEUNG U, YOO, GWON IL, LEE, JAE HWAN, CHOI, SUK YEONG, BAE, YU RI, KIM, MIN JI, CHA, HYEOK JIN, JUNG, NAK CHIL, CHOI, YEONG SU, LEE, SU HYEON, LEE, GEUN JU, WOO, JE SEON, HONG, SEONG JAE, CHOI, JAE ROK, JUNG, YONG MAN, SEO, HYEON JIN, HAN, CHEOL, RYU, MI SEON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DYES FREQUENCY-CHANGING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-LINEAR OPTICS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PAINTS PHYSICS POLISHES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PURPOSE: A sealant composition for a liquid crystal panel is provided, to allow a curing velocity to be controlled easily for reducing processing time, to improve adhesion and to reduce the percent defect of liquid crystal alignment. CONSTITUTION: The sealant composition comprises 100 parts by weight of at least one kind of binder resin selected from the group consisting of partially acrylated epoxy-based resins represented by the formulas 1, 2 and 3; 5-50 parts by weight of a potential thermal curing agent; 0.1-20 parts by weight of a photoinitiator; and 10-60 parts by weight of an inorganic filler. In the formula 1, R1s are independently H or a methyl group; X is a C3-C16 alkyl or hydroxyalkyl group containing an epoxy group; Y is a C3-C16 acrylated (meth)acrylate group; and 0