APPARATUS FOR INSPECTING WAFER EDGE TO REDUCE TIME FOR INSPECTION PROCESS

APPARATUS FOR INSPECTING WAFER EDGE TO REDUCE TIME FOR INSPECTION PROCESS

PURPOSE: An apparatus for inspecting a wafer edge is provided to reduce a time for an inspection process and enhance reliability by inspecting a defect of a wafer edge according to intensity of light reflected from the wafer edge. CONSTITUTION: A chuck(110) is used for supporting a wafer. A pluralit...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KIM, HUI DEOK
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KIM, HUI DEOK
description PURPOSE: An apparatus for inspecting a wafer edge is provided to reduce a time for an inspection process and enhance reliability by inspecting a defect of a wafer edge according to intensity of light reflected from the wafer edge. CONSTITUTION: A chuck(110) is used for supporting a wafer. A plurality of optical sensors(120,124,126) are arranged nearly to an edge part of the wafer. Each optical sensor includes a light emitting unit for irradiating the light on the edge and a receiving part for receiving the light reflected from the edge part. A handling unit is connected to the chuck in order to scan the edge part of the wafer. A central processing unit determines correctly a defect of a wafer edge according to a detecting state of the reflected light.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20040094967A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20040094967A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20040094967A3</originalsourceid><addsrcrecordid>eNrjZPB0DAhwDHIMCQ1WcPMPUvD0Cw5wdQ7x9HNXCHd0cw1ScHVxd1UI8VcIcnUJdQayPH1dURT6-ykEBPk7uwYH8zCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSSeO8gIwMDEwMDSxNLM3NHY-JUAQDgNi4A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>APPARATUS FOR INSPECTING WAFER EDGE TO REDUCE TIME FOR INSPECTION PROCESS</title><source>esp@cenet</source><creator>KIM, HUI DEOK</creator><creatorcontrib>KIM, HUI DEOK</creatorcontrib><description>PURPOSE: An apparatus for inspecting a wafer edge is provided to reduce a time for an inspection process and enhance reliability by inspecting a defect of a wafer edge according to intensity of light reflected from the wafer edge. CONSTITUTION: A chuck(110) is used for supporting a wafer. A plurality of optical sensors(120,124,126) are arranged nearly to an edge part of the wafer. Each optical sensor includes a light emitting unit for irradiating the light on the edge and a receiving part for receiving the light reflected from the edge part. A handling unit is connected to the chuck in order to scan the edge part of the wafer. A central processing unit determines correctly a defect of a wafer edge according to a detecting state of the reflected light.</description><edition>7</edition><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20041112&amp;DB=EPODOC&amp;CC=KR&amp;NR=20040094967A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20041112&amp;DB=EPODOC&amp;CC=KR&amp;NR=20040094967A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, HUI DEOK</creatorcontrib><title>APPARATUS FOR INSPECTING WAFER EDGE TO REDUCE TIME FOR INSPECTION PROCESS</title><description>PURPOSE: An apparatus for inspecting a wafer edge is provided to reduce a time for an inspection process and enhance reliability by inspecting a defect of a wafer edge according to intensity of light reflected from the wafer edge. CONSTITUTION: A chuck(110) is used for supporting a wafer. A plurality of optical sensors(120,124,126) are arranged nearly to an edge part of the wafer. Each optical sensor includes a light emitting unit for irradiating the light on the edge and a receiving part for receiving the light reflected from the edge part. A handling unit is connected to the chuck in order to scan the edge part of the wafer. A central processing unit determines correctly a defect of a wafer edge according to a detecting state of the reflected light.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPB0DAhwDHIMCQ1WcPMPUvD0Cw5wdQ7x9HNXCHd0cw1ScHVxd1UI8VcIcnUJdQayPH1dURT6-ykEBPk7uwYH8zCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSSeO8gIwMDEwMDSxNLM3NHY-JUAQDgNi4A</recordid><startdate>20041112</startdate><enddate>20041112</enddate><creator>KIM, HUI DEOK</creator><scope>EVB</scope></search><sort><creationdate>20041112</creationdate><title>APPARATUS FOR INSPECTING WAFER EDGE TO REDUCE TIME FOR INSPECTION PROCESS</title><author>KIM, HUI DEOK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20040094967A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2004</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, HUI DEOK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, HUI DEOK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>APPARATUS FOR INSPECTING WAFER EDGE TO REDUCE TIME FOR INSPECTION PROCESS</title><date>2004-11-12</date><risdate>2004</risdate><abstract>PURPOSE: An apparatus for inspecting a wafer edge is provided to reduce a time for an inspection process and enhance reliability by inspecting a defect of a wafer edge according to intensity of light reflected from the wafer edge. CONSTITUTION: A chuck(110) is used for supporting a wafer. A plurality of optical sensors(120,124,126) are arranged nearly to an edge part of the wafer. Each optical sensor includes a light emitting unit for irradiating the light on the edge and a receiving part for receiving the light reflected from the edge part. A handling unit is connected to the chuck in order to scan the edge part of the wafer. A central processing unit determines correctly a defect of a wafer edge according to a detecting state of the reflected light.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; kor
recordid cdi_epo_espacenet_KR20040094967A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
title APPARATUS FOR INSPECTING WAFER EDGE TO REDUCE TIME FOR INSPECTION PROCESS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T00%3A28%3A22IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KIM,%20HUI%20DEOK&rft.date=2004-11-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20040094967A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true