SUBSTRATE PROCESSING APPARATUS TO IMPROVE THROUGHPUT BY FORMING TRANSFER PATHS

PURPOSE: A substrate processing apparatus is provided to reduce the size of equipment and improve throughput by forming a plurality of transfer paths disposed in parallel with each process station and by carrying a wafer to/from the process units of each process station. CONSTITUTION: The first process station is installed in one side of the first transfer path(100) with respect to the first transfer path for carrying a substrate. The second process station is installed in the other side of the first transfer path, confronting the first process station. The second transfer path(600) confronts the first transfer path with respect to the first process station. The substrate is carried to/from each station by transfer robots(101,601) installed in the first and second transfer paths so that a predetermined process is performed on a corresponding substrate.