METHOD FOR DETERMINING ETCHING AREA OF MATERIAL BY PLACING DETECTOR ADJACENT TO PART WHICH IS TO BE ETCHED AND ETCHING CONTROL ASSEMBLY

PURPOSE: A method for determining the etching area of a material and an etching control assembly are provided to stop etching depending on the resistance of a detector during or after etching by placing the detector adjacent to a material to be etched and accurately determining the etching area of t...

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Bibliographische Detailangaben
Hauptverfasser:	GHOZEIL ADAM, BARNES TEDW, SUDYKA WILLIAM J, CHAVARRIA VICTORIO, EMERY TIMOTHY R
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CORRECTION OF TYPOGRAPHICAL ERRORS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES LINING MACHINES MEASURING METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PERFORMING OPERATIONS PHYSICS PRINTING SELECTIVE PRINTING MECHANISMS SEMICONDUCTOR DEVICES STAMPS TESTING TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	PURPOSE: A method for determining the etching area of a material and an etching control assembly are provided to stop etching depending on the resistance of a detector during or after etching by placing the detector adjacent to a material to be etched and accurately determining the etching area of the material. CONSTITUTION: A method for determining the etching area of a material(22) includes the steps of placing a detector of variable width adjacent to a part(40) of the material to be etched and measuring the resistance of the detector during etching. The detector is formed by doping the material. The detector has a width to realize low resistance.