CMP APPARATUS FOR CONDITIONING POLISHING PAD DURING POLISHING PROCESS

CMP APPARATUS FOR CONDITIONING POLISHING PAD DURING POLISHING PROCESS

PURPOSE: A CMP apparatus is provided to maintain constantly a surface state of a polishing pad by using a conditioner for conditioning the polishing pad during a polishing process. CONSTITUTION: A platen(41) is used for loading a wafer. A polishing pad(42) is adhered on a surface of the platen. A po...

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Bibliographische Detailangaben
1. Verfasser: JUNG, MYEONG JIN
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE: A CMP apparatus is provided to maintain constantly a surface state of a polishing pad by using a conditioner for conditioning the polishing pad during a polishing process. CONSTITUTION: A platen(41) is used for loading a wafer. A polishing pad(42) is adhered on a surface of the platen. A polishing head(43) is used for pushing and supporting the wafer. A diameter of the polishing head is smaller than the diameter of the platen. A slurry supply nozzle is installed on a bottom of the platen in order to supply slurries(47) to the polishing pad. A diamond ring, a diamond ring holder, the first and the second driving sources are used for regenerating a surface of the polishing pad in a polishing process.