METHOD FOR FORMING LOCAL INTERCONNECTION OF SEMICONDUCTOR DEVICE

PURPOSE: A method for forming a local interconnection of a semiconductor device is provided to reduce filed recess and prevent a junction leakage by preventing a filed insulation layer from being etched in etching an insulation layer in a metal formation region for a local interconnection by a damas...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AHN, JONG HYEON, JUN, JIN WON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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