METHOD AND APPARATUS FOR CLEANING SUBSTRATE
PURPOSE: A method and an apparatus for cleaning a substrate are provided to clean effectively the substrate by performing selectively a dipping/cleaning process, a liquid injection/cleaning process, and a gas injection/cleaning process. CONSTITUTION: A substrate(W) is dipped into the cleaning soluti...
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Format: | Patent |
Sprache: | eng ; kor |
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Zusammenfassung: | PURPOSE: A method and an apparatus for cleaning a substrate are provided to clean effectively the substrate by performing selectively a dipping/cleaning process, a liquid injection/cleaning process, and a gas injection/cleaning process. CONSTITUTION: A substrate(W) is dipped into the cleaning solution within a process chamber(1). The cleaning solution is circulated by rotating the substrate within the process chamber. An overflow process is performed by filling up the inside of the process chamber with water. A rinsing process is performed by injecting alternately the cleaning solution and the water into the substrate. A cleaning gas is injected onto the rotating substrate. The inside of the process chamber is filled up with the water. The substrate is dipped into the water within the process chamber. The substrate is rinsed by performing the overflow process. |
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